Together with our local partner PLOTTEC, we just installed our first wire bonding machine 56 series from F&S BONDTEC.
The machine has been installed in CTI (Centro de Tecnologia da Informação Renato Arche) in Campinas, Brazil. An important research reference center of the Brazilian market.
With this new acquisition CTI is now prepared to bond the most complex chips/substrates with very high repeatability (3 micron) and maximum flexibility to make ball-wedge, wedge-wedge deep access and ribbon.
EMEA Electro Solutions Team