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Manual & Semi Automatic Die Bonder

Die bonding, Flip Chip Bonding, ACF.

Everything is possible with TRESKY machines!

You can click in every picture to download the datasheet. Contact us for more information!

T-4909 Manual Die Bonder T-3000 Manual Die Bonder with wafer holder T-3000 FC3 Semi-Automatic Die Bonder with motorized Z-Axis
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