+34 934 616 742 info@emeaelectrosolutions.com

Microelectronics (5)

Die bonding, Flip Chip Bonding, ACF.

Everything is possible with TRESKY machines!

You can click in every picture to download the datasheet. Contact us for more information!


T-4909 Manual Die Bonder T-3000 Manual Die Bonder with wafer holder T-3000 FC3 Semi-Automatic Die Bonder with motorized Z-Axis
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Pull Tester & Shear Tester

Wire Testing Machines:

F&S Bondtec Lab-Tester Semi-Automatic Tester F&S Bondtec 5600C & 5600CS Automatic Tester
If you need more information do not hesitate to contact us at info@emeaelectrosolutions.com

Wire Bonding AOI

Quality checking is a real challenge after wire bonding process.

You could solve it now with Wire Bonding Automatic Optical Inspection Machines from VISCOM!



VISCOM Wire Bonding AOI In-line Machine: VISCOM Wire Bonding AOI Table Top Machine:
polaris uflex
Ultrasonic Die Bonding, Eutectic Bonding.

Everything is possible with TRESKY Automation machines!

You can click in every picture to download the datasheet. Contact us for more information!


T-6000-L High Precision T-6000-L/G T-8000-G Large working area
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Wire Bonding

Our Wire Bonding Machines:

F&S Bondtec 53xx F&S Bondtec 56xx F&S Bondtec 58xx F&K Delvotec 2018
Low volume (no Recognition) Mid volume (with PR) High volume (with PR) High volume (with PR)
If you need more information do not hesitate to contact us at info@emeaelectrosolutions.com