S3016 ultra – Bottom-Side 3D AOI
3D bottom-side inspection of PCB solder joints
- Highest Performance
Brand new powerful 3D XM sensor concept for bottom-side inspection - Best Inspection Quality
Shadow-free inspection due to 8 angled cameras - Minimum Time and Training Requirements
due to Viscom standard software - System Flexibility
Flexible handling of various test object types - Optimal Inspection Process Design
in terms of enhanced PCB handling option
Downloads & Resources
| SMD | THT | |
| Presence | x | x |
| XY-position | x | x |
| Rotation | x | |
| Component height | x | |
| Polarity | x | |
| No solder | x | x |
| Bad solder | x | x |
| Lifted lead/tombstone | x | |
| Bridge | x | x |
| Pin height | x | |
| Nonwetting pin | x | |
| Nonwetting pad | x | |
| Blow hole | x | |
| Optional: | ||
| Open area analysis | Wobble circle error | Color ring analysis |
| OCR | VOIDs in the soldered connection |
Solder ball/solder spray |