Technology is our world
Technology is our world
SPA Software Entwicklungs GmbH serves customers worldwide with specific software programs for the industrial automation of production systems. Furthermore we offer complete systems with high-precision measurement technology as well as image acquisition with associated data analysis for wafer inspection to well-known companies in the semiconductor industry.
Our Wafer Metrology Systems offer unique stress/defect analysis and ion implantation monitoring for quality inspection of 300 mm wafers for high volume manufacturers.
Our Scanning Acoustic Microscopes are used for defect detection, quality control and nondestructive failure analysis of bonded wafers and packaged electronics. We specialize in high throughput production environments and fully automated handling systems.
Microwave generated plasma is the superior plasma technology for microchip fabrication.
Microwave plasma creates an etching process, which is very isotropic and behaves very similar to a wet stripping process. The very high electron density and low kinetic ion energy makes this process ideal for removal of polymers while causing very little surface damage.
Scanning Acoustic Microscope designed by PVA TePla Analytical System
PVA TePla Analytical Systems designs and manufactures state of the art Scanning Acoustic Microscopes. Technological developments have focused on the detection of structural defects and materials characterization within opaque materials. Voids, inclusions, delaminations, cracks and even density variations are all defects sensitive to the technique of acoustic microscopy.
RF plasma systems are the most widely used and versatile plasma technology. This plasma technology is applied to a broad spectrum of industrial, semiconductor and medical device applications.
Material surfaces that require cleaning, coating or chemical modification are immersed into the energetic environment of an RF plasma. Although they are subjected to chemically reactive species that are carried to their surfaces by the directional effects of many RF plasma systems. These directional effects can carry momentum under the right conditions. A plasma system can physically remove more inert surface contaminants and cross-linking polymers to lock the plasma treatment in place.
The plasma systems can be customized to meet a customers specific application and through-put needs. The chamber, electrodes, power generator and vacuum pumps are scaled based on the the size and shape of the specific substrate to be processed. For example the generator frequency can be in the ranges of 40 kHz, 100 kHz, 150 kHz, 13.56 MHz with wattage’s from 1 to 2000 watts depending on the particular process requirements.
PVA Tepla America brings significant experience in designing equipment. With Proper engineering a RF plasma system can be designed to fit the precise need of the application without adding unnecessary costs and can usually meet the customers particular budget requirements.
Plasma made from atmospheric air is highly oxidative. Layers of absorbed molecules, such as oil and water on metallic surfaces, are easily removed with this type of plasma technology. Plastics are oxidized at the surface using atmospheric plasma. This type of treatment to plastics increases the wettability and adhesion of inks and glues by increasing the surface energy.
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