Technology is our world
Technology is our world
Flexibility
TRESKY’s entry-level model, the DIE bonder T-6000-L, is a fully automatic placement system for universal and specific use in prototyping as well as series production.
The T-6000-L offers an unprecedented level of flexibility through a high degree of modularity. Fast switching between different bonding techniques is possible at any time and the manual mode enables fast bonding results without programming.
Fully Automatic and Manual
For a customized bonding result, the T-6000-L can be equipped with numerous options that can be added to the placement process at any time.
The T-6000-L guarantees reproducible and highly accurate results for any placement application and best bonding performance in the market. The unique manual mode enables instant DIE bonding.
This model covers all common bonding technologies and is designed to meet today’s and tomorrow’s challenges in semiconductor manufacturing.
The Art of Engineering
Based on the proven T-6000-L series, the DIE bonder T-6000-L/G has been further developed. This consists of a stable granite gantry and a high-precision control system for the X, Y and Z axes. The system therefore offers the best bonding performance in the market and is designed for the current and future challenges in the semiconductor industry.
All Common Connection Technologies
The T-6000-L/G guarantees reproducible and accurate results for highly precise placement applications. Optionally, the T-6000- L/G can be upgraded with a loading and unloading module to further optimize cycle times and to reduce downtime.
Due to the wide range of process options, the T-6000-L/G offers high versatility in combination with speed and high precision. The system can be further expanded at any time with additional options. Thus, our customers receive an individual system tailored to their needs, with which both manual and fully automatic processes can be implemented reliably and effectively. The intuitive software enables simple and easy operation and programming of the system.
This model covers all common connection technologies.
The Art of Engineering
The T-8000-G DIE bonder is the result of continuous engineering development and offers a larger working area in which 12-inch wafers can be processed. The bonding system combines precision with versatility and speed based on a generously sized granite gantry that allows for maximum accuracy. Thus, the T-8000-G is designed for current and future challenges.
From Prototype to Production
Based on the solid granite chassis, equipped with linear motors and high-resolution direct measuring systems, the machine offers the largest working range within the product portfolio as well as the best bonding performance in the market. In addition, the T-8000-G is compatible with numerous existing as well as custom-made options and offers the most versatile process possibilities. The bonder can handle any application in assembly and connection technology and combines precision, versatility and speed. Due to its flexibility and modularity, the T-8000-G can be used for prototyping as well as for series production. The manual mode enables fast bonding results without programming.
This model covers all common bonding technologies.
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