Technology is our world
Technology is our world
For the past 40 years, Dr. Tresky has been perfecting the art of creating handling and pick & place systems.
As a solutions provider, Dr. Tresky supports specific applications with their highly accurate and innovative systems. Starting from manual to automatic, from adhesives to tools, exactly as per our customer’s need. This is made possible by Dr. Tresky’s extensive experience and modular setup which allows the adaptation of various basic systems with countless options for new processes.
With almost 2000 devices installed across the world, often with special & customized equipment, Dr. Tresky diligently works to fulfill complex process requirements. Supported by a fast, flexible and professional team ready to be tested, we look forward to your challenge!
Budget sensitive Manual Die Bonder
The T-4909-AE is Tresky’s 40-year anniversary model. On basis of the T-4909 we developed a new software running on an integrated Raspberry PC. Like all Tresky Die Bonder this pick & place system operates with True Vertical Technology™. The increased travel range, now 95mm on Z, allows working on various bonding heights for Epoxy-, Eutectic- and Flip-Chip processes.
PC controlled Manual Die Bonder
The T-5100 is the successor of the proven and well known T-3000-M series with many features of the PRO-series. It is an universal workhorse for a wide range of micro-assembly tasks. The manual operation makes it so very flexible and adaptable to many tasks in the R&D area, and it is just as popular for small-scale and pilot production.
The extremely rigid machine, with its completely redeveloped base is compact and fits on a lab desk. It can be expanded with many
different modules to cover an enormous range of applications.
Operating a Tresky die bonder/placer is intuitive. A few minutes’ training is sufficient to start working
with the machine. The accuracy and repeatability of placing parts is superb thanks to a number of wellthought
out features like a true, linear Z-Axis, Force Control, XY Fine Control and high-resolution
optics that allow flip-chip placing down to sub-micron accuracy.
PC controlled Manual Die Bonder
Unique pick-up from wafer
The T-5100-W version features the same flexibility than the T-5100 and has the additional advantage of handling wafers, which sits below the main table with Tresky’s pneumtatic die ejection system.
The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the T-5100-W incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the platform is the industry’s most sophisticated system in its class and with the new intuitive software even easier to operate.
The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate.
The T-3002-PRO is a Chip Bonder with programmable and motorised Z-axis. It is also equiped with Tresky’s proven die ejector system for pick-up from wafer.
Manual Bonder with semi auto. process capabilities
Tresky’s T-5300 is the flagship of our Die Bonders and adds a motorized, programmable Z-axis, with our True Vertical Technology™, to the repertoire of the universal T-5100, making it extra useful for repetitive processes in small-scale production, where operator influence must be minimized. The T-5300 really shines in applications with highest precision requirements, such as flip-chip, or eutectic placement. An optional high-resolution beam splitter unit allows sub-micron placement accuracy.
Manual Bonder with semi auto. process capabilities
Wafer Handling capability
The T-5300-W version offers the same flexibility as the T-5300 with the added benefit of being able to handle wafers with Tresky’s electric die ejection system, which is located under the main table located. The system has all the basic features to run the most advanced applications in the industry. For this you can add a wide range of available options. Like all Tresky products, the T-5100-W includes True Vertical Technology™, which guarantees parallelism between chip and substrate at any connection height. Along with superior ergonomics, the platform is the industry’s most advanced system in its class and is even easier to use with the new intuitive software.
The T-5300-W version features the same flexibility than the T-5100 and has the additional advantage of handling a wafer of up to 200mm which sits below the main table with Tresky’s elctrical die ejection system.
Typical and customized applications:
Tresky’s T-5500 adds a High Force Machine to the line of the T-5100 and T-5300. The sophisticated design of the integrated HF-module, up to 100Kg, in combination with the Tresky True Vertical Technology ensures an absolute coplanarity between chip and substrate at any height and force during the bonding process.
The T-5500 is equipped with a motorized, programable Z-axis and new with a motorized Theta-axis (spindle rotation). The T-5500, with its Bonding Force up to 100Kg, really shines in applications with highest precision requirements in Thermocompression Bonding, such as Sinter-Bonding and Flip-Chip.
Die Bonding systems from Dr. Tresky are the first choice wherever the highest demands are placed on positioning accuracy, the fastest implementation of a wide variety of assembly processes and a wide range of technologies.
Our customers and industries, for which we develop and offer joint solutions, are just as diverse as our die bonder systems. This also applies to the various construction and connection technologies that have to be implemented.
Our development laboratory is available for this, together with the most modern analysis methods. Together with our highly qualified and experienced specialist staff, we can offer you a perfectly coordinated overall package that is tailored precisely to you and your requirements.
Customized solutions for individual applications:
EMEA Electro Solutions is always online, always updated and connected to you.
Our Product Managers are fully trained to help you. Just let us know what are your needs and specifications.
Our aim is provide you best in class and state of the art solutions.
Always with our customers, full service support.
