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On the world market – unrivaled equipment. No operator influences, lowest operator costs. Therefore patented. Any number of wire bonds can be programmed and fully automatically destructive or non-destructive tested.
The 5600Ci
Automatic Bond Tester 5600Ci
The automatic bond tester 5600Ci complements F&S Bondtec Semiconductor GmbH die- and wire-bonders. It is unique on the world market and patented.
The PC controlled moving table allows any number of bonds to be tested automatically from a stored program. Results can be analysed and output immediately or exported in a number of data base formats for subsequent analysis as desired.
Powerful extended capabilities enable measurements such as force/time curves to be made and deliver more data about the quality of the bond tested. Exchangeable measurement cartridges ensure rapid conversion to different force ranges. The calibration curves of all measurement cartridges are stored internally; additional heads for shear, peel and tweezer testing with customerspecific tools and jaws are available.
After a first programming a reproducible pull- or sheartest can be guaranteed for all following components.
Testheads
Pullheads – 100 cN to 5.000 cN
Shearheads – 500 cN to 50.000 cN
Bondheads
10i, 30i, 32i, 50i, 50iHR
CSR – Corporate Standard Report
Data analysis even for largest data sets from bond testing in series production
Clear data base structure and selection of test samples offering wide filtering options
On-screen display, analysis and configurable reports
Statistical analysis (Min, Max, average and standard deviation)
Cp/Cpk process control, SPC and trend analysis
Export of filtered test data for external analysis
5600 – Pull- & Sheartester
Manual testing of thin- and heavy wire bonds
Easily changeable cartridges
Workholder
Standard-Workholder for parts up to 4×4″ with Vacuum and mechanical clamping
