Technology is our world
Home » Microelectronics » Research & Development » Wire bonding
The wire bonders from F&S Bondtec are flexible in their application and testify to the highest quality. Thanks to years of experience and proven technologies, the wire bonders of F&S Bondtec are always able to meet the high demands of its customers. For many years, the company has been characterized by its innovative strength and customer orientation. The wire bonders from F&S Bondtec offer the best quality and an unbeatable price-performance ratio. Characteristic of all our wire bonders are quick and easy changeable bondheads to support all necessary bonding processes. Equally important is an intuitive software that optimally supports the bonding process and thus enables the best possible result.
F&S Bondtec offers the perfect development machine with its manual wire bonder. Simple operation, extremely adaptable bonding settings, at an unbeatable price-performance ratio.
With the semi-automatic wire bonders from F&S Bondtec you get all bonding technologies for in-house production. Due to exchangeable bonding heads suitable for all wire bonding and test methods.
The automatic wire bonders from F&S Bondtec make them the perfect production machine for small to medium production volumes with the highest quality requirements.
EMEA Electro Solutions is always online, always updated and connected to you.
Our Product Managers are fully trained to help you. Just let us know what are your needs and specifications.
Our aim is provide you best in class and state of the art solutions.
Always with our customers, full service support.