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Granite-Based Precision The T-7000 machine platform has been developed for use in nanoelectronics and optoelectronics due to its precision. As is standard at Tresky, the bonder platform is based on granite, so that the highest possible precision can be guaranteed for optical components such as VCSELs, lasers, photodiodes, IR sensors or for the development of quantum technologies.
Leader in Micro-Assembly Technological miniaturisation and functional integration in microelectronics and optoelectronics are essential for future-oriented product innovations. Micro-assembly and assembly and connection technology play a crucial role in the realization of these technological innovations in new and marketable products.
We have developed the T-7000 to successfully realize these requirements. The platform offers sub-micron placement accuracy, a travel range of 500 x 700 mm and a bonding head with minimum bonding forces of up to 0.01 N. On customer request, the bonding force range can be optionally increased to 100 N, 300 N or 500 N.
This model covers all common bonding technologies.
Product
highlights
Manual mode
Multichip capable
Post-bond inspection
Software-programmed temperature control
Wafer mapping
OCR
Traceability
MES
Automated dispensing needle calibration
Customised splitting
Scrubbing
Various image recognition
Bonding in cavities (15 mm)
Preform punching
Modules & Options
Air-suspended bond head
Vibration feeder
Wafer handling system
Stamping module
Component feeders
Formic Acid Module
Wafer table with DIE ejector
UV indexer
WRGB ring light
Heating plates (up to 450°C; ΔT ramps up to 60 K/s)