Technology is our world
The wire bonders from F&S Bondtec are flexible in their application and testify to the highest quality. Thanks to years of experience and proven technologies, the wire bonders of F&S Bondtec are always able to meet the high demands of its customers. For many years, the company has been characterized by its innovative strength and customer orientation. The wire bonders from F&S Bondtec offer the best quality and an unbeatable price-performance ratio. Characteristic of all our wire bonders are quick and easy changeable bondheads to support all necessary bonding processes. Equally important is an intuitive software that optimally supports the bonding process and thus enables the best possible result.
F&S Bondtec offers the perfect development machine with its manual wire bonder. Simple operation, extremely adaptable bonding settings, at an unbeatable price-performance ratio.
With the semi-automatic wire bonders from F&S Bondtec you get all bonding technologies for in-house production. Due to exchangeable bonding heads suitable for all wire bonding and test methods.
The automatic wire bonders from F&S Bondtec make them the perfect production machine for small to medium production volumes with the highest quality requirements.
The compact, space-saving wire bonder F & K M17S is a true multi-talent. In no time at all, it can be converted to all common wire bonding methods.
For maximum productivity at low operating costs, the application specialists at F&K Delvotec match the automation depth precisely to the customer’s product: Smartomation as a guarantee for low total cost of ownership.
The advantages
The options
Highly productive and always with zero defects in view: The fully automatic, compact wire bonder F & K M17D has been specially adapted to the mass production of power semiconductors and power modules in the automotive industry.
It is the only wire bonder on the market that offers the possibility of bonding thin wire and thick wire or thick wire ribbons in one process on one machine.
The advantages
The options
The fully automatic wire bonder F & K M17L not only offers the world’s largest working range for thin wire bonders. It can also be converted to bond heads for deep access or thick wire.
In addition, there is an enormous variety of automation options for manual component handling, single or dual track transport systems or even combined manual and automated component feeding. And all this in variants up to 500 mm clearance height for huge components.
The advantages
The options
Wire bonder F & K M17XL – the first wire bonder with a working area of almost one square metre
The largest working area worldwide makes bonding large components such as battery modules for electric vehicles or concentrator cells child’s play. The guarantee for best quality and zero-defect production: Despite the long travel distances, the robot arm is positioned absolutely vibration-free and accurate to the micrometre.
The advantages
The options
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