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HSP-CF-H – Semi rigid Foam


HSP’s semi rigid conductive foam is designed to protect sensitive integrated components from static discharge by ensuring a uniform potential between all the pins.

The semi rigid nature is specifically designed to allow easy insertion with out damaging pins, whilst holding the component firmly.

HSP-CF-H is non corrosive, non shedding and non marking and has surface resistivity of 103 to 105 Ohms/square.

The material is available in 6mm and 10mm as standard (other thicknesses available on request), and can be supplied in full sheets or cut parts.




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