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Reliable 3D SPI with Quality Uplink, process control and DualView

S3088 SPI – 3D SPI

  • Precise control of all essential 3D features; calibration-free
  • Extremely high throughput due to FastFlow Handling
  • Integrated height tracking
  • Viscom Quality Uplink: process optimization and first-pass yield increase
  • Simple process analysis with the Viscom Uplink Analyzer
  • Fast program generation
  • Print optimization through interlinkage with printer (closed loop)

Downloads & Resources

Insufficent solder Excessive solder Missing solder
Solder bridge/short circuit Contamination Offset print
Smearing of paste Paste shape defect X placement
Y placement Rotation Form defect
Surface inspection OCR