Reliable 3D SPI with Quality Uplink, process control and DualView
S3088 SPI – 3D SPI
- Precise control of all essential 3D features; calibration-free
- Extremely high throughput due to FastFlow Handling
- Integrated height tracking
- Viscom Quality Uplink: process optimization and first-pass yield increase
- Simple process analysis with the Viscom Uplink Analyzer
- Fast program generation
- Print optimization through interlinkage with printer (closed loop)
Downloads & Resources
| Insufficent solder | Excessive solder | Missing solder |
| Solder bridge/short circuit | Contamination | Offset print |
| Smearing of paste | Paste shape defect | X placement |
| Y placement | Rotation | Form defect |
| Optional: | ||
| Surface inspection | OCR |