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BGA Inspection System

Premium BGA Solder Joints Inspection

New generation side-view optical system, designed for fast and flexible optical inspection, analysis and documentation of hidden solder joints of BGA, μBGA. FipChip, CSP, CGA and top-view SMD components.

Powered by INSPECTIS© ProX

Powerful still easy-to-use software providing tools for live image view, advance camera control, image/video/audio capture, geometrical measurements, image overlays and comparison, focus stacking, annotations and reporting among other features.

Developed for Productivity

High resolution optics coupled with high-power LED lighting system, robust optical probe and fast USB3.0 camera interface produces clear, crisp and high frame-rate real-time video of the hidden solder joints.