S3088 DT – Dual Track 3D AOI
- Technology – High throughput, peak performance camera technology
- Inspection depth – 2D / 2.5D and 3D inspection with up to 8 angled views
- Variant diversity – SPI, AOI, CCI and UFI camera configuration options
- Versatility – Double or single track systems possible
- Networking – Complete connection to cutting-edge Industry 4.0 interfaces
- Footprint – Integrated monitor for reduced system dimensions
Downloads & Resources
Post Reflow
| Insufficient solder | Excessive solder | Missing solder |
| Solder bridge, short circuit | Tombstone | Lifted lead |
| Soldering error | Non-wetting | Contamination |
| Missing component | Polarity | Misplaced component |
| X placement | Y placement | Rotation |
| Broken component | Wrong component | Flipped component |
| Billboarding | Bent lead | Damaged lead |
| Excess component | Form defect | |
| Optional: | ||
| Surface inspection | Circumference defects | Electronic color codes |
| OCR | VOIDs | Solder balls/splash |
S3088 Ultra Chrome – High-Performance 3D AOI
Extremely fast and precise inspection for high-volume production
- Highest throughput for manufacturing
- Reliable quality assurance
- Highly effective process control tools
- Simple and intuitive system operation
- Customer hotline and website, remote maintenance
Downloads & Resources
| Not enough solder | Too much solder | Missing solder |
| Solder bridging/short circuit | Tombstone effect | Lifted lead |
| Solder defects | Solderability | Contamination |
| Missing component | Polarity error | Component displaced |
| Rotation | Component damaged | Incorrect component |
| Face down component | Component on its side | Twisted pin |
| Damaged pin | Component equipped too much | Form defects |
| Optional: | ||
| Open area analysis | Wobble circle error | Color ring analysis |
| OCR | VOIDs in the soldered connection |
Solder ball/solder spray |
S3088 ultra gold – High-Speed 3D AOI
Very reliable high-speed 3D inspection for soldered connections
- Extremely fast AOI camera system
- Scalable, modular camera technology with 3D measuring function
- Greatest inspection depth: reliable inspection of 03015 and fine-pitch components
- Maximum fault coverage – 9 views plus 3D measurement
- Best resolution at angled views
- Height measurement of components
- Extremely high throughput due to FastFlow Handling
- Fast program generation with vVision/EasyPro
- Reading DataMatrix code, bottom up
Downloads & Resources
| Not enough solder | Too much solder | Missing solder |
| Solder bridging/short circuit | Tombstone effect | Lifted lead |
| Solder defects | Solderability | Contamination |
| Missing component | Polarity error | Component displaced |
| Rotation | Component damaged | Incorrect component |
| Face down component | Component on its side | Twisted pin |
| Damaged pin | Component equipped too much | Form defects |
| Optional: | ||
| Open area analysis | Wobble circle error | Color ring analysis |
| OCR | VOIDs in soldered connection |
Solder ball/solder spray |