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X7056-II – 3D AXI/3D AOI

3D X-ray inspection – Extremely fast and flexible

  • Revolutionary handling concept xFastFlow for printed circuit boards change in as little as 4 seconds
  • Ultra thorough inspection of single or double-sided electronic assemblies
  • System can be used as a 3D AXI system or 3D AXI/3D AOI combination
  • Three different flat panel detector sizes for scalable throughput
  • Versatile and adaptable inspection depth
  • Additional vertical slices for optimum analyses and dependable verification
  • Viscom Quality Uplink: Effective networking and process optimization
  • Comprehensive IPC-compliant AXI inspection library
  • High-quality 3D AXI volume calculation with planar CT
  • Highest in-line AXI resolution for the best defect coverage and detection

Downloads & Resources

Insufficient solder Excess solder Missing solder
Solder bridging/short circuit Tombstone effect Lifted lead
Solder defect Solderability Contamination
Missing component Polarity error Displaced component
Rotation Component damaged Incorrect component
Face down component Component on its side Excess components
Form defects Twisted pin Damaged pin
THT filling degree Voids in the solder joint BGA head in pillow
Open area analysis Wobble circle error Wicking effect
Color ring analysis OCR Solder ball/solder spray
VOIDs in the solder joint