X7056-II – 3D AXI/3D AOI
3D X-ray inspection – Extremely fast and flexible
- Revolutionary handling concept xFastFlow for printed circuit boards change in as little as 4 seconds
- Ultra thorough inspection of single or double-sided electronic assemblies
- System can be used as a 3D AXI system or 3D AXI/3D AOI combination
- Three different flat panel detector sizes for scalable throughput
- Versatile and adaptable inspection depth
- Additional vertical slices for optimum analyses and dependable verification
- Viscom Quality Uplink: Effective networking and process optimization
- Comprehensive IPC-compliant AXI inspection library
- High-quality 3D AXI volume calculation with planar CT
- Highest in-line AXI resolution for the best defect coverage and detection
Downloads & Resources
Insufficient solder | Excess solder | Missing solder |
Solder bridging/short circuit | Tombstone effect | Lifted lead |
Solder defect | Solderability | Contamination |
Missing component | Polarity error | Displaced component |
Rotation | Component damaged | Incorrect component |
Face down component | Component on its side | Excess components |
Form defects | Twisted pin | Damaged pin |
THT filling degree | Voids in the solder joint | BGA head in pillow |
Optional: | ||
Open area analysis | Wobble circle error | Wicking effect |
Color ring analysis | OCR | Solder ball/solder spray |
VOIDs in the solder joint |