X7056RS – 3D AXI/3D AOI
Bestseller among in-line X-ray systems
- Inspection of electronics assemblies populated on one or both sides
- Greatest flexibility through 3D, 2.5D or 2D AXI
- Flat Panel Detectors (FPD) or image intensifiers (depending on application)
- High inspection depth through XM 3D or 8 M camera technology
- Viscom Quality Uplink: process optimization and first-pass yield increase
- Comprehensive IPC-compliant AXI inspection library
- Best in-line AXI resolution for maximum fault coverage
- Optional AOI integration with no loss of speed
- Optional: Open or sealed X-ray tube
Downloads & Resources
Insufficient solder | Excessive solder | Missing solder |
Solder bridging/short circuit | Tombstoning | Lifted lead |
Soldering error | Non-wetting | Contamination |
Missing component | Polarity defect | Displaced component |
Rotation | Damaged component | Incorrect component |
Face down component | Billboarding | Excess component |
Form defect | Bent lead | Damaged lead |
THT filling degree | ||
Optional: | ||
Open area inspection | Circumference defects | Wicking-up effect |
Electronic color codes | OCR | Solder balls/splash |
VOIDs | BGA head-in-pillow |