– Gold-Ball-Bonding for wires from 17,5 to 50 μm using Standard-Capillaries 16 mm to 19 mm
– Dual frequency-US-generator for 60/100 kHz – further Bondfrequencies available on request
– Bumping, Safety-Bump, Stitch-on-Ball
– Programmable Z-Axis 60mm

– Wedge-Wedge-Bonding with 1“ Tools for Aluminum- and Goldwires from 17,5 to 75 μm and ribbon up to 250 x 25 μm
– 45° wireguide, retrofitable to 30° and 60° – according to component geometry
– Dual frequency-US-generator for 60/100 kHz further Bondfrequencies available on request
– Programmable Z-Axis 60 mm and Y-Axis 25 mm

– Deep Access Wedge-Wedge-Bonding with 1“ or ¾“ Tools
– 90° wireguide for Aluminum- and Goldwires from 17,5 to 75 μm
– Gold-Ball-Bonding for wires from 17,5 to 50 μm with capillaries 16 -19 mm
– Perfect for difficult and constricted bonding geometries
– Also useable for ribbon of aluminum und gold
– Programmable Z-Axis 60 mm and Y-Axis 25 mm
– optional: retrofitable to 5380 DIE-Bonder

– Heavy wire bonding for aluminum wire from 100 up to 500 µm diameter
– Heavy wire bonding for copper wire from 100 up to 300 µm diameter
– Wedge-Tool length from 50 to 70 mm also for extreme bonding requirements
– Stitch- or chain bonds of any length
– Clip-on-wire guide for quick exchange
– Programmable Z-Axis 60mm and Y-Axis 25 mm

– Heavy Ribbon bonding for aluminum ribbons up to 2 mm width
– Increased programmable bond force up to 6,000 cN, also with force and power ramps
– Active ribbon guide to improve loop shaping
– Programmable Z-Axis 60mm and Y-Axis 25 mm
– Optional: retrofitable to 5350 HR heavy ribbon bondhead

– Different DIE-sizes process oriented useable
– Manual DIE-bonding with Touchdown-Detection and programmable
pickup- and bond force
– 2 x 2“ working area for any Waffle-, Gel-Packs or Trays
– Bond- and pickup force from 5 up to 500 cN programmable