• Gold-Ball bonding for wires from 12 to 50 µm using stadard capillaries 16 mm to 19 mm
• Highly sensitive, contactless electronic touchdown sensor and digitally controlled, programmable bond force for delicate component surfaces
• Digital ultrasonic generator provides adjustable bond frequencies
• Bumping, safety-bump, stitch-on-ball
• Deformation Limit Control (DLC) for real-time quality checks

• Wegde-wedge bonding using 1″ tools  for aluminum and gold wirdes from 12 to 75 µm strength
• 45° wire guide. convertible to 30° or 60° – depending on compontent geometry
• Digital ultrasonice generator provides adjustable bond frequencies
• Deformation Limit Control (DLC) for real-time quality checks

• Deep Access Wegde-Wedge bonding using 1″ or 3/4″ tools
• 90° wire guide for aluminum and gold wirdes from 12 bis 75 µm
• Perfect for difficult and constricted bonding geometries
• Ideally suited for aluminum and gold ribbons
• Deformation Limit Control (DLC) for real-time quality checks

• Heavy wire bonding for aluminum from 100 up to 500 µm diameter
• Heavy wire bonding for copper wire from 100 up to 300 µm diameter
• Wedge lengths of 50 up to 70 mm even for extreme bonding requirements
• Stitch- or chain bonds of any length
• Clip-on-wire guide for quick exchange
• Deformation Limit Control (DLC) for real-time quality checks

• Heavy Ribbon bonding for aluminum ribbons up to 2 mm width
• Increased programmable bond force up to 6,000 cN, also with force and power ramps
• Active ribbon guide to improve loop shaping
• Deformation Limit Control (DLC) for real-time quality checks
• Optional: convertible from standard 5650 bond head

• For manual testing of thin and heavy wire bonds
• Easy cartridge change

– Test heads with exchangeable cartridges
– Camera for automatic testing
– Analysis software