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The only fully Automatic Bond Tester

On the world market – unrivaled equipment. No operator influences, lowest operator costs. Therefore patented. Any number of wire bonds can be programmed and fully automatically destructive or non-destructive tested.

The 5600Ci

Automatic Bond Tester 5600Ci

  • The automatic bond tester 5600Ci complements F&S Bondtec Semiconductor GmbH die- and wire-bonders. It is unique on the world market and patented.
  • The PC controlled moving table allows any number of bonds to be tested automatically from a stored program. Results can be analysed and output immediately or exported in a number of data base formats for subsequent analysis as desired.
  • Powerful extended capabilities enable measurements such as force/time curves to be made and deliver more data about the quality of the bond tested. Exchangeable measurement cartridges ensure rapid conversion to different force ranges. The calibration curves of all measurement cartridges are stored internally; additional heads for shear, peel and tweezer testing with customerspecific tools and jaws are available.
  • After a first programming a reproducible pull- or sheartest can be guaranteed for all following components.

Testheads

  • Pullheads – 100 cN to 5.000 cN
  • Shearheads – 500 cN to 50.000 cN

Bondheads

  • 10i, 30i, 32i, 50i, 50iHR

CSR – Corporate Standard Report

  • Data analysis even for largest data sets from bond testing in series production
  • Clear data base structure and selection of test samples offering wide filtering options
  • On-screen display, analysis and configurable reports
  • Statistical analysis (Min, Max, average and standard deviation)
  • Cp/Cpk process control, SPC and trend analysis
  • Export of filtered test data for external analysis

5600 – Pull- & Sheartester

  • Manual testing of thin- and heavy wire bonds
  • Easily changeable cartridges

WORKHOLDER

  • Standard-Workholder for parts up to 4×4″ with Vacuum and mechanical clamping
Substrathalter_4x4_mechanische-Klemmung

OPTIONAL:

Substrathalter_4x4_mechanische-Klemmung_2

workholders up to 4×4″ with jaws

TO-Aufnahme-mit-mechanischer-Klemmung

TO mount with mechanical clamp

Substrathalter_gummierte-oberfläche

4×4 “workholder with rubberized surface, with mechanical clamping

CHANGEABLE CARTRIDGES

PH100 – PH5000

  • Pull testing of thin/heavy wires and heavy ribbons
  • Suitable pull hook sizes for wire diameters from 15 μm to 500 μm
  • Test cartridges for forces up to 50 N, matching to your application
  • Finely tunable 360° rotation for precise positioning of pull hook to the wire

SH500 – SH5000

  • Shear testing of ball bonds, heavy wires and heavy ribbons
  • Also suited for SMD- and solder ball shear testing
  • Test cartridges for forces up to 50 N, matching to your application
  • Air nozzle for compressed air to remove shear residues and particles

Testing Tool Simulation

  • Virtual test drive trough the whole testing program
  • Proof of free room for placing and rotating the pullhook overlayed on the live picture
  • Alignment of the tool position for shear testing

CSR – Corporate Standard Report

  • Data analysis even for largest data sets from bond testing in series production
  • Clear data base structure and selection of test samples offering wide filtering options
  • On-screen display, analysis and configurable reports
  • Statistical analysis (Min, Max, average and standard deviation)
  • Cp/Cpk process control, SPC and trend analysis
  • Export of filtered test data for external analysis
  • Automatic calculation of real pullforces at source- and destinationbond for standard-compliant testing (patented by F&S BONDTEC)

PRU – Pattern Recognition Unit

  • Recognition of position marks for automatic alignment of the testing program
  • Independently tunable lighting systems
  • Digital filters for optimization of recognition results
  • Proofed in our wire bonding systems for a wide range of surfaces

5600i – Pull- & Sheartester

  • Manual testing of thin- and heavy wire bonds
  • Easily changeable cartridges

5600Ci – Automatic Pull- & Sheartester

  • Test head with changeable cartridges
  • Camerasystem for automatic testing
  • Analysis software

Downloads & Resources

The 5600CSi

BOND-TESTER 5600CSi

  • The automatic bond tester 5600CSi is unique on the world market and patented
  • The PC controlled moving table allows any number of bonds to be tested automatically from a stored program. Results can be analysed and output immediately or exported in a number of data base formats for subsequent analysis as desired.
  • Powerful extended capabilities enable measurements such as force/time curves to be made and deliver more data about the quality of the bond tested. Exchangeable measurement cartridges ensure rapid conversion to different force ranges. The calibration curves of all measurement cartridges are stored internally; additional heads for shear, peel and tweezer testing with customerspecific tools and jaws are available

WORKHOLDER

  • Standard-Workholder for parts up to 4×4″ with Vacuum and mechanical clamping
Substrathalter_4x4_mechanische-Klemmung

OPTIONAL:

Substrathalter_4x4_mechanische-Klemmung_2

workholders up to 4×4″ with jaws

TO-Aufnahme-mit-mechanischer-Klemmung

TO mount with mechanical clamp

Substrathalter_gummierte-oberfläche

4×4 “workholder with rubberized surface, with mechanical clamping

CHANGEABLE CARTRIDGES

PH100 – PH5000

  • Pull testing of thin/heavy wires and heavy ribbons
  • Suitable pull hook sizes for wire diameters from 15 μm to 500 μm
  • Test cartridges for forces up to 50 N, matching to your application
  • Finely tunable 360° rotation for precise positioning of pull hook to the wire

SH500 – SH5000

  • Shear testing of ball bonds, heavy wires and heavy ribbons
  • Also suited for SMD- and solder ball shear testing
  • Test cartridges for forces up to 50 N, matching to your application
  • Air nozzle for compressed air to remove shear residues and particles

Testing Tool Simulation

  • Virtual test drive trough the whole testing program
  • Proof of free room for placing and rotating the pullhook overlayed on the live picture
  • Alignment of the tool position for shear testing

CSR – Corporate Standard Report

  • Data analysis even for largest data sets from bond testing in series production
  • Clear data base structure and selection of test samples offering wide filtering options
  • On-screen display, analysis and configurable reports
  • Statistical analysis (Min, Max, average and standard deviation)
  • Cp/Cpk process control, SPC and trend analysis
  • Export of filtered test data for external analysis
  • Automatic calculation of real pullforces at source- and destinationbond for standard-compliant testing (patented by F&S BONDTEC)

PRU – Pattern Recognition Unit

  • Recognition of position marks for automatic alignment of the testing program
  • Independently tunable lighting systems
  • Digital filters for optimization of recognition results
  • Proofed in our wire bonding systems for a wide range of surfaces

5600Ci – Automatic Pull- & Sheartester

  • Test head with changeable cartridges
  • Camerasystem for automatic testing
  • Analysis software

Downloads & Resources

BAMFIT TESTER

BAMFIT (Bondtec Accelerated Mechanical Fatigue Interconnection Test) is a completely new test method for estimating bond life and reliability of heavy wire wedge bonds. It is the perfect extension of the classic Power Cycling Test (PC): the cyclic stress of the wire bond due to temperature cycling is replicated by mechanical stress, but with significantly higher cycle speed. This allows PC tests, often lasting weeks or months, to be simulated within minutes.

  • The revolutionary BAMFIT-test can easily be implemented on every base unit of the 56XX series by installing a dedicated test head
  • The software is closely related to the standard versions for bonders and testers. It is capable of fully automatic testing of any number of bonds, employing automatic adjustments by pattern recognition
  • Test results are recorded in a SQL data base and can be evaluated at any time in a variety of ways

Test Head

The proprietary clamping tool grips the bond foot from the sides and at a defined height; a touchdown system automatically compensates height variations in the substrate

Test Tool
for heavy wires from 125 to 500 µm;
user-exchangable within minutes

Test Time
1 test < 1 minute

Test Force
Pull force in Z direction, typically 20 to 40 cN

Test Frequency
60 and 80 kHz, programmable Ultrasonice Generator

Test Amplitude
Corresponds to temperature swing in PC test; programmable between 0 and 1 µm

Test Data
Tool position and ultrasonic data are registered continuously and stored in a SQL data base for subsequent evaluation

Downloads & Resources