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T-8000-G Flexible Automatic Die Bonder

The T-8000-G Die Bonder is a fully-automated all-purpose system built on a granite mainframe. Developed for a higher throughput and more accuracy, best fit for medium sized production.This platform offers a large working area especially for 12“ wafer handling. Open, with a wide range of applications and numerous available options, the T-8000-G can be customized to best suit all market needs.

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