VS 320

The main benefits of Vacuum Soldering during soft-soldering-process up to 450 ° C through the controlled use of gases during assembly process are:

• Bonding surfaces free from oxide and cavities, ranging from chip to ceramic substrate
• Integrated or separate implementation of cleaning and scaling processes
• No or only very minor amounts of residual contamination on the product
• No degassing processes on the product
• Different pressure areas can be created inside of the sealed chambers
• Sealing of chambers with a previously defined gas atmosphere
• Assembly in high vacuum
• Integration of drying and degassing processes
• Possibility of a further miniaturization
• The better derivation of heat loss
• A considerably increased yield in production