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VS 160S

The main benefits of Vacuum Soldering during soft-soldering-process up to 450 ° C through the controlled use of gases during assembly process are:

  • Bonding surfaces free from oxide and cavities, ranging from chip to ceramic substrate
  • Integrated or separate implementation of cleaning and scaling processes
  • No or only very minor amounts of residual contamination on the product
  • No degassing processes on the product
  • Different pressure areas can be created inside of the sealed chambers
  • Sealing of chambers with a previously defined gas atmosphere
  • Assembly in high vacuum
  • Integration of drying and degassing processes
  • Possibility of a further miniaturization
  • The better derivation of heat loss
  • A considerably increased yield in production