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M17 D

Wire Bonder F & K M17D – the first and only wire bonder with two heads on a single chassis

Highly productive and always aiming for zero defects: the fully automatic, compact wire bonder F & K M17D was adapted to the special requirements of mass production of power semiconductors and power modules in the automotive industry. It is the only wire bonder on the market offering the possibility to bond fine and heavy wire or heavy ribbon in a single machine.


  • Combination of fine and heavy wire in a single process
  • Wire diameters from 17 to 600µm, ribbon dimensions 2.000 x 300µ
  • Rapid and easy conversion in under 15 minutes
  • Extremely space saving
  • Work area in mm: X=254 mm, Y= 153 mm (optionally 204 mm), z = 40mm (optionally 60 mm)
  • Work area in inches:: X = 10″, Y = 6″ (optionally 8″), Z = 1,5″ (optionally 2,3″)
  • Continuous monitoring and control of the bond process using the Bond Process Contol
  • Comprehensive automation from manual to in-line

M17 L

Wire Bonder F & K M17L– the Perfect Allrounder

It doesn’t get any more flexible than this: the fully automatic wire bonder F & K M17L not only boasts the largest working area for thin wire bonders. It can also be reconfigured with bond heads for deep access, heavy wire or heavy ribbon. Add to that an enormous range of automation options for manual handling, single- or double-track feeding systems or even combined manual and automatic parts handling. And all of this comes in variants for up to 500 mm height clearance for very tall components.


  • Platform suitable for all current wire bond technologies
  • Wire diameters from 17 to 600 µm, ribbons up to 2,000 x 300 µm cross-section
  • Simple and rapid changeover of bond head within 15 minutes
  • Very large work area: 635 mm (X) x 350 mm (Y), 100 mm (Z); 25“ x 14“
  • Continuous monitoring and real-time control of the bond process using patented Bond Process Contol
  • Large range of automation from manual to in-line, also combined or dual-lane
  • Variants for extremely tall parts, up to 500 mm clearance

M17 S

Wire Bonder F & K M17S – the first and only fully automatic all-in-one bonder in the world

The compact, space saving Wire Bonder F & K M17S is a veritable multi-talent. It can be converted to any current Wire Bond process in a very short time.

For the highest productivity and the lowest operating costs the applications experts at F&K Delvotec determine the degree of automation for the customer product: Smartomation as guarantee for low Total Cost of Ownership.

Benefits of the M17 platform

  • Suitable for all wire bond technologies
  • Quick and simple changeover in under 15 minutes
  • Continuous monitoring and control of the bond process with the patented Bond Process Control
  • Multiple possibilities for automation from manual to in-line

M17 S – Ball Wedge

M17S Ball-Wedge – highest quality bonds in the most challenging applications

The M17S Ball-Wedge patented rotating bond head keeps ultrasonic oscillation at the 2nd bond in perfect alignment.

The rotation feature also ensures future proof accessibility with relief capillaries and nEFO lance positioning in XYZ & P. The new graphical flame-off data, coupled with the BPC process parameters, enables comprehensive data logging for ultimate traceability and absolute peace of mind.


  • Compensation free ultrasonic perfection through +/- 200°
  • Future proof accessibility through +/- 200°
  • 2.5 wires/sec depending on application
  • Ultimate process monitoring with flame off graphical data logging

M17 XL

Wire Bonder F & K M17XL – the first wire bonder with a working area of almost one square metre

With the XL wire bonder, as so often in the past, F & K DELVOTEC engineering accomplished innovative pioneering work. The largest work area in the world makes childs play of bonding large components such as battery modules for electro-vehicles or concentrator cells.

A guarantee for the best quality and zero defect production: despite the large travelling distance the robotic arm remains vibration free and is positioned with micron accuracy.


  • Largest work area on the market: 1.130 mm (X) x 700 mm (Y); 44″ x 27″
  • The robotic arm moves the bond head completely vibration-free over the full working area
  • Access to the work area from all sides enables manual loading
  • Simple and rapid changeover of bond head within 15 minutes
  • Continuous monitoring and control of the bond process using the camera aided Bond Process Control
  • Comprehensive automation from manual to in-line