S6053BO-V – Inline AOI
Reliable inspection of wire bonds, components and conductive adhesive in one step.
- Inspection of minimal wire thicknesses up to 15 µm
- Reliable differentiation of wire courses
- Recognition of defective bonds
- Reliable SMD component inspection
- Inspection of conductive adhesive bond
- Simple operation and inspection program generation with EasyPro
- Flexible conveyor concept: Single track or double track
- The data matrix code can be read from the program flow
Downloads & Resources
| Missing ball/stitch | Position ball/stitch exceeds tolerance |
Shape and geometry ball/ |
| “Golf clubs” | Pad contamination | Missing wedge |
|
Wedge position exceeds |
Foreign material, pad contamination | Missing wire |
| Incorrect wire loop | Curling, shortage | Missing component |
|
Positon/rotation |
Tilted component | Wrong component type |
| Reversed polarity |
Scratches/foreign material on surface |
Flipped component |
| Chipping |
Missing/excessive epoxy underfill |
Insufficient solder |
| Excessive solder | Missing solder | Solder bridge/short |
| Tombstone | Lifted lead | Soldering error |
| Non-Wetting | Contamination | Misplaced component |
| X placement | Y placement | Rotation of solder paste |
| Broken component | Wrong component | Excess component |
| Billboarding | Form defect | Bent lead |
| Damaged lead |