S6056BO – Inline AOI
High-performance automatic in-line wire bond inspection for high throughput.
- Precise, reliable inspection down to wire diameters of 17 µm
- Reliable detection of defective wire paths, dies and component position
- Combined inspection of wire bonds and SMD placement
- Secure detection of damaged and misplaced components
- Inspection of conductive adhesive bond
- Reliable inspection of larger inspection objects
- Individually adaptable inspection scope
- Simple operation and inspection program generation with EasyPro
- Possible to read data matrix code from program flow
- Ideal for single and double track operation
Downloads & Resources
| Missing component | Missing ball/stitch | Missed solder joint |
| Slanted component (tilt) | Ball/stitch position out of tolerance | Insufficient solder |
| Face down component | Ball/stitch geometry deviation | Solder bridging/short circuit, general solder defects |
| Tombstoning | “Golf club” | Nonwetting |
| Contaminated component | Contaminated pad | Missing conductive adhesive |
| X/Y component displacement | Missing wedge | Conductive adhesive residue |
| Component rotation out of tolerance | Wedge rotation out of tolerance | |
| Damaged component | Wedge geometry deviation | |
| Incorrect component | Wedge position out of tolerance | |
| Excess components | Contaminated land, capillary imprint | |
| Component on its side | Missing wire | |
| Twisted lead | Defective wire course | |
| Damaged lead | Not enough clearance to adjacent wires, short circuit | |
| Lifted lead | ||
| Reversed polarity | ||
| THT hole fill | ||
| Void | ||
| Scratched chip surface | ||
| Edge chipping | ||
| Optional: | ||
| Open area analysis | Wobble circle error | Electronic color code analysis |
| OCR | VOIDs in the solder joint | Solder ball/solder sputter |
| Coplanarity inspection |