x7056bo – AXI/AOI
Combined AOI/AXI inspection solution for total wire bond inspection and detection of hidden connectors
- Precise, reliable inspection down to wire diameters of approx. 25 µm
- Reliable detection of defective wire paths, dies and component position
- Combined inspection of wire bonds and SMD placement
- Secure detection of damaged and misplaced components
- Inspection of conductive adhesive bond
- Reliable inspection of hidden connectors
- Individually adaptable inspection scope
- Simple operation and inspection program generation with EasyPro
- Possible to read data matrix code from program flow
- Viscom Quality Uplink: process optimization and first-pass yield increase
- Best in-line AXI resolution for the highest defect coverage
- Versatile camera module selection for thick and thin wires
Downloads & Resources
Missing component | Missing ball/stitch | Missed solder joint |
Slanted component (tilt) | Ball/stitch position out of tolerance | Insufficient solder |
Face down component | Ball/stitch geometry deviation | Solder bridging/short circuit, general solder defects |
Tombstoning | “Golf club” | Nonwetting |
Contaminated component | Contaminated pad | Missing conductive adhesive |
X/Y component displacement | Missing wedge | Conductive adhesive residue |
Component rotation out of tolerance | Wedge rotation out of tolerance | |
Damaged component | Wedge geometry deviation | |
Incorrect component | Wedge position out of tolerance | |
Excess components | Contaminated land, capillary imprint | |
Component on its side | Missing wire | |
Twisted lead | Defective wire course | |
Damaged lead | Not enough clearance to adjacent wires, short circuit | |
Lifted lead | ||
Reversed polarity | ||
THT hole fill | ||
Void | ||
Scratched chip surface | ||
Edge chipping | ||
Optional: | ||
Open area analysis | Wobble circle error | Electronic color code analysis |
OCR | VOIDs in the solder joint | Solder ball/solder sputter |
Coplanarity inspection | BGA head in pillow | Wicking effect |