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x7056bo – AXI/AOI

Combined AOI/AXI inspection solution for total wire bond inspection and detection of hidden connectors

  • Precise, reliable inspection down to wire diameters of approx. 25 µm
  • Reliable detection of defective wire paths, dies and component position
  • Combined inspection of wire bonds and SMD placement
  • Secure detection of damaged and misplaced components
  • Inspection of conductive adhesive bond
  • Reliable inspection of hidden connectors
  • Individually adaptable inspection scope
  • Simple operation and inspection program generation with EasyPro
  • Possible to read data matrix code from program flow
  • Viscom Quality Uplink: process optimization and first-pass yield increase
  • Best in-line AXI resolution for the highest defect coverage
  • Versatile camera module selection for thick and thin wires

Downloads & Resources

Missing component Missing ball/stitch Missed solder joint
Slanted component (tilt) Ball/stitch position out of tolerance Insufficient solder
Face down component Ball/stitch geometry deviation Solder bridging/short circuit,
general solder defects
Tombstoning “Golf club” Nonwetting
Contaminated component Contaminated pad Missing conductive adhesive
X/Y component displacement Missing wedge Conductive adhesive residue
Component rotation out of tolerance Wedge rotation out of tolerance
Damaged component Wedge geometry deviation
Incorrect component Wedge position out of tolerance
Excess components Contaminated land, capillary imprint
Component on its side Missing wire
Twisted lead Defective wire course
Damaged lead Not enough clearance to adjacent wires, short circuit
Lifted lead
Reversed polarity
THT hole fill
Scratched chip surface
Edge chipping
Open area analysis Wobble circle error Electronic color code analysis
OCR VOIDs in the solder joint Solder ball/solder sputter
Coplanarity inspection BGA head in pillow Wicking effect