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The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate.

The T-3002-PRO is a Chip Bonder with programmable and motorised Z-axis. It is also equiped with Tresky’s proven die ejector system for pick-up from wafer.


Datasheet (PDF)


Manual Bonder with semi auto. process capabilities

Tresky’s T-5300 is the flagship of our Die Bonders and adds a motorized, programmable Z-axis, with our True Vertical Technology™, to the repertoire of the universal T-5100, making it extra useful for repetitive processes in small-scale production, where
operator influence must be minimized. The T-5300 really shines in applications with highest
precision requirements, such as flip-chip, or eutectic placement. An optional high-resolution
beam splitter unit allows sub-micron placement accuracy.


Machine Overview

Datasheet (PDF)


Manual Bonder with semi auto. process capabilities

Wafer Handling capability

The T-5300-W version offers the same flexibility as the T-5300 with the added benefit of being able to handle wafers with Tresky’s electric die ejection system, which is located under the main table located. The system has all the basic features to run the most advanced applications in the industry. For this you can add a wide range of available options. Like all Tresky products, the T-5100-W includes True Vertical Technology™, which guarantees parallelism between chip and substrate at any connection height. Along with superior ergonomics, the platform is the industry’s most advanced system in its class and is even easier to use with the new intuitive software.

The T-5300-W version features the same flexibility than the T-5100 and has the additional advantage of handling a wafer of up to 200mm which sits below the main table with Tresky’s elctrical die ejection system.

Typical and customized applications

• Die sorting from wafer into waffle packs or gel packs
• Die attach with adhesive (stamped or dispensed)
• 3D packaging of MEMS, MOEMS, VCSEL, Photonics, …
• High-precision placement with visual adjustment by beam-splitter unit for look-up inspection of
edges, corners or patterns, e.g. for laser bars
• Flip-Chip with ultrasonic die attach
• Flip-Chip with adhesives or anisotropic foils
• Sensor assembly
• UV curing of die attach
• Eutectic bonding of AuSi, Copper Pillar and others
• Ultrasonic bonding on a curved surface


Machine Overview

Datasheet (PDF)


Tresky Die Bonders can be equiped or upgraded with several options. According to your specific needs you can configure your perfect piece of equipment.

Stamping and flux station

Suitable for stamping of adhesive or for dipping of picked-up Flip-Chip (or any other component) into Flux before placement.

Both processes use the same motorised adhesive/flux container. The motorised container is maintaining a defined and constant layer of flux or adhesive. For stamping of adhesives application, is the stamping tool, attached to the dispenser arm by means of an adapter.

All Tresky Die Bonder can be equipped with a stamping and flux station.

Download datasheet

Ultrasonic bonding head

The ultrasonic unit extends the range of application of Dr. Tresky AG Chip Bonders to include thermal and ultrasonic applications. The digital generators have an adjustable power up to 40W or for higher demands up to 100W at a frequency of 90kHz. The ultrasonic transducer is mounted on the rotating spindle with a few hand movements, which guarantees a flexible use.

All Dr. Tresky machines can be equipped with an ultrasonic unit.

Download datasheet

UV curing unit

The UV curing unit is designed for fast UV adhesive curing during the bonding process on the Chip Bonder machine. A high-end light source and the automatic cover of the dispensing needle are included with this option. The field of application is wide and includes both micro-component and optical component connections such as glass fibres, VCSELs and photodiodes.
All Tresky machines can be equipped with a UV curing unit.

Datasheet download

Eutectic Overview

Many bonding processes in microelectronics require the supply of heat. That is why Dr. Tresky AG has developed a wide range of static and dynamic heaters and a powerful software package.

All Tresky Die Bonder can be equipped with the following options:

  • TO Heating Unit
  • Heating plates for static heating
  • Heating plates for temperature profiles with cooling
  • Tool heating for temperature profiles with cooling
  • Software for graphical programming with real time display
  • Inert gas chamber available for all heating plates
  • 2nd spindle for pre-form handling
  • Scrub or Ultrasonic

Download datasheet

Dynamic TO-Heating Unit

Seeing increased demands on the market Tresky offers now the second generation of the dynamic TO-Heating Unit with excellent qualities.

  • For TO sizes up to D30mm / pin lengths 24mm
  • Heating ramp up to 40K/s
  • Max. temperature 400°C
  • Gas chamber and gasflow controller
  • TO Indexer optionally available

Download datasheet

Flip-Chip Ultra

Tresky’s Flip-Chip Ultra module is a beam splitter optics, which allows the simultaneous viewing of two objects by an optical overlay (superposition) on the monitor.

The Flip-Chip optics has a built-in Ultra HD camera with digital magnification as well as integrated LED lights for optimal illumination of various substrates and components. In combination with the high magnification and the fineadjustment of the XY-Table Micro an accuracy of +- 1µm can be reached.

All Tresky Die Bonder can be equipped with a Flip-Chip Ultra option.

Technical Specification:

  • 400x digital zoom Ultra HD camera
  • Field of view 0.9mm x 1,2mm – 6,5mm x 4.8mm
  • LED illumination (up, down and coax)
  • Multipoint Alignment 30mm x 10mm
  • XL Version with Multi Point Alignment up to 85mm x 50mm

Download datasheet

Flip-Station for Dies

The Tresky Die Flip-Station is designed to minimize the mechanical stress on the Chip to avoid any damage. The soft flipping of the Die upside down is gentle controlled and can be activated manual or automatic. An exchangeable tip and support plate allows to handle a wide range of Die sizes. The adjustable speed and height gives you the most possible flexibility to flip a Die.

It’s possible to flip any devices. Tool change is very simple.

All Tresky Die Bonder can be equipped with a Flip-Station.

Download datasheet