S3016 ultra – Bottom-Side 3D AOI
3D bottom-side inspection of PCB solder joints
- Highest Performance
Brand new powerful 3D XM sensor concept for bottom-side inspection - Best Inspection Quality
Shadow-free inspection due to 8 angled cameras - Minimum Time and Training Requirements
due to Viscom standard software - System Flexibility
Flexible handling of various test object types - Optimal Inspection Process Design
in terms of enhanced PCB handling option
Downloads & Resources
SMD | THT | |
Presence | x | x |
XY-position | x | x |
Rotation | x | |
Component height | x | |
Polarity | x | |
No solder | x | x |
Bad solder | x | x |
Lifted lead/tombstone | x | |
Bridge | x | x |
Pin height | x | |
Nonwetting pin | x | |
Nonwetting pad | x | |
Blow hole | x | |
Optional: | ||
Open area analysis | Wobble circle error | Color ring analysis |
OCR | VOIDs in the soldered connection |
Solder ball/solder spray |