High Frequent Fluxing Technology
High frequency, high-speed, drop jet fluxing meets every cycle time and drop size requirement and increases the process window up to 5 times. Clogging is reduced with larger hole dimension of 180µm.

Smart Teach Programming

• Standard offline programming software
• Program without using machine capacity
• Automatic snap function aligning program over through-hole
• Automatic calibration, process proposal, and flux volume calculation
• Uses .DXF, Gerber or pixel based input

SDC Debridging Tool
SDC (Solder Drainage Conditioner) acts as a hot nitrogen knife to ensure bridge-free soldering. The patented SDC tool is designed to ensure stable wave dynamics and improve thermal solderability. Nitrogen temperature and velocity are separately adjustable. SDC is a critical feature for robust fine-pitch soldering.

Click here to watch SDC video

Selectwave Solderpot
ZEVAm+ features point-to-point or drag soldering with a rotating nozzle to reduce cycle time. The solderpot is covered to minimize nitrogen consumption and dross formation. On the ZEVAm+ a movable electromagnetic solderpot allows soldering under an angle.

Closed-loop Preheater Management
Active and precise control of PCB temperature. with automatic adjustment of lamp power to reach desired temperature at the end of the preheat cycle. Improved process control and board to board repeatability with no additional cycle time.

Precision Wave Height Control
The wave height of the Selectwave is measured without contact by a laser sensor. The solder level is adjusted to optimal height with no additional cycle time. This Improves process control and board-to-board repeatability.

Management Information System & Barcode Integration

• Barcode integration allows automatically selection of correct program
• Management Information System saves all set and actual values of a specific soldered product into a log file
• Linking barcode and management information provides full traceability
• Connectivity to host computer and Manufacturing Execution Systems (MES)

Non-Wettable Nozzle
Lead-free solders will erode wettable nozzles which require you to exchange the nozzle tip. The iron that is dissolved forms crystals which is polluting the solder alloy. Non-wettable nozzles are maintenance-free and specially treated to eliminate erosion from lead-free solder.

Closed-loop Flux Flow Control
Integrated mass flow meter has capability to measure during the whole flux cycle directly in the supply circuit to the nozzle.

Sustainability has been part of the design requirements for the ZEVA series of machines

• Solderpot sized have been decreased as much as possible resulting in lower power consumption, lower solder usage and less solder waste in the form of dross formation.
• Power management has been implemented to eliminate peeks in energy consumption.
• Preheat elements are mounted parallel to the transport direction and can be switched off in case they are not required for the board in production.
• Nitrogen atmosphere has been optimized in order to reduce nitrogen consumption, reduce the formation of dross, reduce flux consumption and increase the first pass yield.

Smart Teach Programming

• Standard offline programming software
• Program without using machine capacity
• Automatic snap function aligning program over through-hole
• Automatic calibration, process proposal, and flux volume calculation
• Uses .DXF, Gerber or pixel based input

SDC Debridging Tool
SDC (Solder Drainage Conditioner) acts as a hot nitrogen knife to ensure bridge-free soldering. The patented SDC tool is designed to ensure stable wave dynamics and improve thermal solderability. Nitrogen temperature and velocity are separately adjustable. SDC is a critical feature for robust fine-pitch soldering.

Click here to watch SDC video

Non-Wettable Nozzle
Lead-free solders will erode wettable nozzles which require you to exchange the nozzle tip. The iron that is dissolved forms crystals which is polluting the solder alloy. Non-wettable nozzles are maintenance-free and specially treated to eliminate erosion from lead-free solder.

Selectwave Solderpot
ZEVAm+ features point-to-point or drag soldering with a rotating nozzle to reduce cycle time. The solderpot is covered to minimize nitrogen consumption and dross formation. On the ZEVAm+ a movable electromagnetic solderpot allows soldering under an angle.

Precision Wave Height Control
The wave height of the Selectwave is measured without contact by a laser sensor. The solder level is adjusted to optimal height with no additional cycle time. This Improves process control and board-to-board repeatability.

Closed-loop Flux Flow Control
Integrated mass flow meter has capability to measure during the whole flux cycle directly in the supply circuit to the nozzle.

Management Information System & Barcode Integration

• Barcode integration allows automatically selection of correct program
• Management Information System saves all set and actual values of a specific soldered product into a log file
• Linking barcode and management information provides full traceability
• Connectivity to host computer and Manufacturing Execution Systems (MES)

High Frequent Fluxing Technology
High frequency, high-speed, drop jet fluxing meets every cycle time and drop size requirement and increases the process window up to 5 times. Clogging is reduced with larger hole dimension of 180µm.

Closed-loop Preheater Management
Active and precise control of PCB temperature. with automatic adjustment of lamp power to reach desired temperature at the end of the preheat cycle. Improved process control and board to board repeatability with no additional cycle time.