The new WebPage from Tresky Automatic includes 360º views of machines and a lot of applications insights. Take a look, and contact us for any question…
Since 1980 the name TRESKY stands for the highest quality, unmatched flexibility with maximum reliability
We are one of the world’s leading machine manufacturers for placement systems in the high-precision sector offering more than 40 years of experience in the semiconductor industry.
Quality “Made in Germany” – We develop, produce and sell Die Bonders from our headquarters in Hennigsdorf. This is near Berlin, Germany.
One Machine, unlimited bonding processes – All standard packaging technologies can be realized with one flexible TRESKY machine. We have extensive experience with multi-chip module applications. It is one of our many strengths.
Designed for tomorrow’s semiconductor needs – The semiconductor market leads the way for many other markets and is therefore constantly changing. Thanks to our modular and flexible machine concept, combined with our numerous innovative options, we enable our customers to react quickly to new technologies, product requirements and new market situations.
Best bonding performance in the market – Our equipment is optimally matched to the requirements of our customers. We record the wishes of our customers and incorporate our many years of experience into the process. This creates critical partnerships with our customers that leads to full satisfaction and long-term business relationships.
Manual Mode – As a special feature, all our machines offer a manual mode in which die bonding proto-type and R&D development can be carried out quickly and precisely without complex programming.
From prototyping to production – Whether in the development of a prototype or in any process step that is important for the creation of a customized Die Bonder – we are involved in the planning from the very beginning.