All-in-one Digital Inverted Microscope for weld bead analysis and measurement. Ultra HD imaging system with motorised zoom optics, auto-focus, built-in illumination, and dedicated software for weld measurements, documentation and reporting....

Premium BGA Solder Joints Inspection New generation side-view optical system, designed for fast and flexible optical inspection, analysis and documentation of hidden solder joints of BGA, μBGA. FipChip, CSP, CGA...

World leader of advanced cleaning and connecting technologies for automated production industry solutions Products or components manufactured with our process solutions can be found in industry sectors that include, automotive,...

iX7059 PCB (XL) Inspection – 3D X-ray inspection for high-density and double-sided PCB assemblies at the highest level With its iX7059 product line, Viscom is setting a new standard for...

Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. At the same time, the requirements...

VISCOM is starting off the year 2021 with one of their many product innovations! The new 3D SPI solution from Viscom features new camera technology which we are combining with...

F&S Bondtec entry-level Series 53 is a blockbuster with almost 700 installed units and counting. It delivers superior bond quality and yet is unrivalled in its ease of use. Simple...

Fagor Electrónica celebrates the opening of a 2.000 square meters new plant in Querétaro, Mexico. EMEA Electro Solutions was involved since the beggining of this process and our team was...