Technology is our world
Technology is our world
PVA TePla is a leading expert in plasma surface treatment, offering world-class technology and enjoying high customer acceptance in all dry etching applications, both frontend and backend.
PulsPlasma® nitriding (PPN) is an advanced thermochemical heat treatment that creates highly wear- and corrosion-resistant nitride layers on steel surfaces. Utilizing a pulsed direct-current glow discharge, PPN efficiently splits environmentally friendly gas mixtures—primarily nitrogen, hydrogen, and methane—under vacuum conditions. This innovative process stands out for its low gas consumption, minimal emissions, and the complete avoidance of harmful by-products, making it both eco-friendly and cost-effective.
PPN technology allows precise control over the structure and properties of the nitride layers. By adjusting key process parameters—such as gas composition, temperature, duration, pressure, and voltage—the treatment can be tailored to meet the specific functional and operational requirements of each component.
Reliable plasma ashing is one of the most essential and underestimated process steps for every successful wafer production. The complexity and miniaturization of wafer lithography, with it’s multiple layers of coatings, masking and unmasking processes, is requiring a selective and dedicated ashing process. This tasks can be perfectly solved with PVA’s GIGAbatch and GIGAfab systems which are already playing an important role in many relevant frontend wafer production lines worldwide.
The backend market for plasma surface treatment encompasses applications in the final manufacturing phase, primarily in the semiconductor, electronics, sensor and medical markets. Our plasma systems are dedicated to backend applications; they clean and activate substrates and dies, helping our customers achieve optimal production yields.
Atmospheric plasma is a surface treatment that has a wide range of applications and is commonly used manually or inline in high‑throughput industrial processes for cleaning, activation, and functionalization of substrates. Since the process occurs at atmospheric pressure, it does not require vacuum chambers. The treatment is fast, effective, and can be precisely targeted.
A vacuum plasma system uses low-pressure gas and RF power to generate reactive species that clean, activate, or modify surfaces without high heat. Applications include removing organic residues, increasing surface energy for better bonding, improving adhesion for coatings and inks, photoresist descum/ashing in electronics, and preparing polymers, metals, glass, and ceramics for assembly. It delivers uniform, repeatable treatment with recipe control (pressure, gas, power, time), supporting industries like semiconductors, electronics, medical devices, automotive/aerospace, and general manufacturing.
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